Thermal management of multiple LEDs for high-power lighting applications
DOI:
https://doi.org/10.52756/ijerr.2023.v36.021Keywords:
High-power lighting, light emitting diode, luminance efficiency, pulse width modulation, thermal management, thermal analysisAbstract
Power LED lighting has suffered from substantial heat generated, leading to significant performance degradation. Consequently, achieving an optimal distribution of LEDs is essential to ensure high luminance efficiency. Implementing effective thermal treatment is important to prevent any potential degradation in the performance of the LED lighting system. Optimizing the arrangement of individual LEDs is a promising approach to mitigating heat accumulation issues. In this paper, we propose a reasonable approach to obtaining the optimal distribution of LED lighting systems under DC biasing and PWM operating conditions. The thermal analysis simulation was performed based on the theoretical assumption to evaluate the thermal distribution of a single LED. Thermal analysis was conducted on an LED lighting system with 20 LEDs, and the distance between LEDs ranged from 4 mm to 24 mm. The simulated analysis showed that the maximum temperature could be controlled from 65.1 ? to 58.7 ?. We discussed the optimum arrangement of LEDs and how heat generated by an LED influences the system. In addition, the LED lighting was operated in PWM mode to mitigate the thermal issues. The relationship between luminance efficiency and operation condition is discussed. Thus, the luminance efficiency improved from 114.8 lm/W to 126.8 lm/W, and the thermal relaxation time was no longer than 0.013 s. The process of determining the optimal distance between LEDs was very effective in achieving an optimized power operating condition and LEDs distribution in the module for a compact volume and enhanced performance.
References
Alam, M. W., Bhattacharyya, S., Souayeh, B., Dey, K., Hammami, F., Rahimi-Gorji, N., & Biswas, R. (2020). CPU heat sink cooling by triangular shape micro-pin-fin: Numerical study. International Communications in Heat and Mass Transfer, 112, 104455. https://doi.org/10.1016/j.icheatmasstransfer.2019.104455
Adhikari, R., Beyragh, D., Pahlevani, M., & Wood, D. (2020). A Numerical and Experimental Study of a Novel Heat Sink Design for Natural Convection Cooling of LED Grow Lights. Energies, 13, 4046. https://doi.org/10.3390/en13164046.
Abdelmlek, K. B., Araoud, Z., Canale, L., Charrada, K., & Zissis, G. (2021). Optimal substrate design for thermal management of high power multi-chip LEDs module. Optik, 242, 167179. https://doi.org/10.1016/j.ijleo.2021.167179.
Bobaru, F., & Rachakonda, S. (2004). Optimal shape profiles for cooling fins of high and low conductivity. International Journal of Heat and Mass Transfer, 47, 4953-4966. https://doi.org/10.1016/j.ijheatmasstransfer.2004.06.013.
Bouknadel, A., Rah, I., El Omari, H., & El Omari, H. (2014, October 17–19). Comparative Study of Fin Geometries for Heat Sinks in Natural Convection. 2014 International Renewable and Sustainable Energy Conference (IRSEC). Ouarzazate, Morocco. https://doi.org/10.1109/IRSEC.2014.7059794.
Chen, W.Y., Shi, X.L., Zou, J., & Chen, Z.G. (2022). Thermoelectric coolers for on-chip thermal management: Materials, design, and optimization. Materials Science and Engineering: R: Reports, 151, 100700. https://doi.org/10.1016/j.mser.2022.100700.
Ekpu. M, Ogbodo, E. A., Ngobigha, F., & Njoku, J. E. (2022). Thermal Effect of Cylindrical Heat Sink on Heat Management in LED Applications. Energies, 15, 7583. https://doi.org/10.3390/en15207583.
Gao, D., Ji, X., Pei, W., Zhang, X., Li, F., Han, Q., & Zhang, S. (2023). Thermal management and energy efficiency analysis of planar-array LED water-cooling luminaires in vertical farming systems for saffron. Case Studies in Thermal Engineering, 51, 103535. https://doi.org/10.1016/j.csite.2023.103535
Ho, C. Y., Wu, W. C., Chen, C. S., Ma, C., & Tsai, Y. H. (2015). Measurement for temperature on a LED lamp. 2015 IEEE International Conference on Consumer Electronics. Taipei, Taiwan. https://doi.org/10.1109/ICCE-TW.2015.7216899.
Hwang, W. J., Lee, T. H., Kim, L., & Shin, M. W. (2004). Determination of junction temperature and thermal resistance in the GaN-based LEDs using direct temperature measurement. Physica Status Solidi (c), 1(10), 2429-2432. https://doi.org/10.1002/pssc.200405098.
Haghighi, S. S., Goshaveshi, H. R., & Safaei, M. R. (2018). Natural convection heat transfer enhancement in new designs of plate-fin based heat sinks. International Journal of Heat and Mass Transfer, 125, 640-647.
https://doi.org/10.1016/j.ijheatmasstransfer.2018.04.122.
Jiu, Y., Fan, H., & Wang, W. (2022). Investigation of a novel natural convection heat sink for LEDs based on U-shaped mini-heat pipe arrays. Applied Thermal Engineering, 204, 118000.
https://doi.org/10.1016/j.applthermaleng.2021.118000.
Lin, Q., Chunqing, W., & Yanhong, T. (2012). Thermal design of a LED multi-chip module for automotive headlights. 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging. Guilin, China. https://doi.org/10.1109/ICEPT-HDP.2012.6474876.
Lai, S. L., Ong, N. R., Shahimin, M. M., Kirtsaeng, S., Sakuntasathien, S., Alcain, J. B., Vairavan, R., Sauli, Z., Thangsi, K., & Retnasamv, V. (2017). Thermal study of LED chip arrangement on MCPCB. 3rd Electronic And Green Materials International Conference 2017. Krabi, Thailand. https://doi.org/10.1063/1.5002448.
Lee, S. (1995). Optimum design and selection of heat sinks. IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 18(4), 812-817. https://doi.org/10.1109/95.477468.
Lin, S.H., Tseng, M.C., Horng, R.H., Lai, S., Peng, K.W., Shen, M.C., Wuu, D.S., Lien, S.Y., Kuo, H.C., Chen, Z., & Wu, T. (2022). Thermal behavior of AlGaN-based deep-UV LEDs. Optics Express, 30(10), 16726-16836. https://doi.org/10.1364/OE.457740
Liu, C.C., Sheen, M.T., Chen, F.M., & Jean, M.D. (2023). Thermal Performance of AlN-Coated High-Power LED Optimized Using Taguchi Statistical Approach. Journal of Electronic Materials, 52, 3706-3718. https://doi.org/10.1007/s11664-023-10292-2
Moradikazerouni, A. (2022). Heat transfer characteristics of thermal energy storage system using single and multi-phase cooled heat sinks: A review. Journal of Energy Storage, 49, 104097. https://doi.org/10.1016/j.est.2022.104097
Mishra, M. K., Chandramohan, V. P., & Balasubramanian, K. (2019). Comparative study of cooling of automobile LED headlights without and with fins and finding comfortable operating conditions. Archive of Mechanical Engineering, 66(3), 295-314. https://doi.org/10.24425/ame.2019.129677
Naphon, P., Nakharintr, L., & Wirivasart, S. (2018). Continuous nanofluids jet impingement heat transfer and flow in a micro channel heat sink. International Journal of Heat and Mass Transfer, 126, 924-932.
https://doi.org/10.1016/j.ijheatmasstransfer.2018.05.101.
Petroski, J. (2003). Understanding longitudinal fin heat sink orientation sensitivity for Light Emitting Diode (LED) lighting applications. the International Electronic Packaging Technical Conference and Exhibition. Maui, Hawaii. https://doi.org/10.1115/IPACK2003-35055.
Patil, G., Kumar, S., Dogra, N., Nindra, J., Kadam, S., & Yadav, K. (2023). A comparison of the shear bond strength of metal orthodontic brackets that have been treated with various light-emitting diode intensities and curing times. International Journal of Experimental Research and Review, 34(Spl.), 1-10. https://doi.org/10.52756/ijerr.2023.v34spl.001
Ramesh, T., Praveen, A. S., & Pillai, P. B. (2022). Experimental investigation of carbon nanotube coated heat sink for LED thermal management. Materials Today: Proceedings, 68(6), 2099-2103. https://doi.org/10.1016/j.matpr.2022.08.370
Ramos-Alvarado, B., Feng, B., & Peterson, G. P. (2013). Comparison and optimization of single-phase liquid cooling devices for the heat dissipation of high-power LED arrays. Applied Thermal Engineering, 59(1-2), 648-659. https://doi.org/10.1016/j.applthermaleng.2013.06.036
Rózowicz, A., Wachta, H., Baran, K., Leśko, M., & Różowicz, S. (2022). Arrangement of LEDs and Their Impact on Thermal Operating Conditions in High-Power Luminaires. Energies, 15, 8142. https://doi.org/10.3390/en15218142.
Sahel, D., Bellahcene, L., Yousfi, A., & Subasi, A. (2021). Numerical investigation and optimization of a heat sink having hemispherical pin fins. International Communications in Heat and Mass Transfer, 122, 105-133. https://doi.org/10.1016/j.icheatmasstransfer.2021.105133.
Sümer, Y., Karaman, O., & Karaman, C. (2021). Design and Thermal Analysis of High Power LED Light. European Mechanical Science, 5(1), 28-33. https://doi.org/10.26701/ems.825141
Tang, Y., Liu, D., Yang, H., & Yang, P. (2019). Thermal Effects on LED lamp With Different Thermal Interface Materials. IEEE Transactions on Electron Devices, 63(12), 4819-4824. https://doi.org/10.1109/TED.2016.2615882.
Tsai, M. Y., Chen, C. H., & Kang, C. S. (2012). Thermal measurements and analyses of low-cost high-power LED packages and their modules. Microelectronics Reliability, 52, 845-854. https://doi.org/10.1016/j.microrel.2011.04.008.
Wu, H.-H., Lin K.-H., & Lin, S.T. (2012). A study on the heat dissipation of high power multi-chip COB LEDs. Microelectronics Journal, 43, 280-287. https://doi.org/10.1016/j.mejo.2012.01.007.
Yu, X., Zheng, P., Zou, Y., Ye, Z., Wei, T., Lin, J., Guo, L., Yuk, H.G. & Zheng, Q. (2022). A review on recent advances in LED-based non-thermal technique for food safety: current applications and future trends. Critical Reviews in Food Science and Nutrition, 63(25), 7692-7707. https://doi.org/10.1080/10408398.2022.2049201.
Zhang, J., Zhang, J., Xu, B., Fu, Q., Wang, C., & Zhao, H. (2022). An improved LED junction temperature test method based on FCM. Journal of Physics: Conference Series, 2395, 102029. https://doi.org/10.1088/1742-6596/2395/1/012029.
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